Semiconductor CNC Machining in Singapore

Vacuum Integrity & Contamination Control

Semiconductor fabrication equipment demands strict control over particle generation, outgassing, and chemical compatibility. We manufacture components with controlled surface roughness down to Ra 0.2µm, precise seal groove geometries, DI water ultrasonic cleaning, and cleanroom double-bagging to protect wafer processing environments.

• Precision tolerances - Down to ±0.01mm on critical alignment features, wafer stages, and chucks
• Cleanroom packaging - ISO Class 6, 7, and 8 controlled cleanrooms for ultrasonic DI cleaning, mechanical sub-assembly, and ESD double-bagging
• Vacuum & plasma compatibility - Validated materials and surface treatments for high-vacuum and corrosive gas environments
• Multi-axis capability - Simultaneous 5-axis CNC milling for complex fluid manifolds, showerheads, and vacuum chambers
• Production milling & turning - 3- and 4-axis CNC milling for chamber lids, base plates and liner plates, and CNC turning for vacuum flanges, spindles and nozzles

For an in-depth specifier's guide on preventing particle shed, vacuum outgassing, and chemical attack on engineering drawings, read our guide on CNC Machining for Semiconductor Equipment: What to Specify and Why.

Semiconductor Applications

• Process chamber components - Vacuum flanges, chamber lids, liner plates, and gas distribution showerheads
• Wafer handling & transfer - Robotic end-effectors, vacuum chucks, transfer arms, and alignment nests
• Gas & liquid delivery manifolds - High-purity fluid blocks, valve bodies, and leak-tight gas delivery channels
• Test & burn-in sockets - High-density probe plates, guide plates, and insulating carriers in engineering plastics and FR4
• Optical & metrology stages - Low thermal expansion brackets, sensor mounts, and interferometer stages

Materials for Semiconductor Equipment

We machine certified high-purity metals and engineering plastics tailored to specific fab process requirements:

• Aluminium (6061-T6, 7075-T6) - Vacuum chambers, robot arms, and base plates finished with clear or hardcoat anodizing
• Stainless steel (316L, 304L) - Vacuum manifolds, gas delivery lines, and corrosive fluid components with optional electropolishing
• PEEK (Unfilled, Ceramic-filled) - Dimensionally stable, chemically resistant wafer contact parts, chucks, and high-voltage insulators
• PEI (Ultem 1000/2300) - High-temperature test sockets, probe heads, and structural dielectric insulators
• PTFE and Polypropylene - Wet bench components, chemical bath tanks, and inert fluid routing
• FR4 / G-10 - High-rigidity insulating backer boards and semiconductor test fixtures
• Invar 36 - Ultra-low thermal expansion mounting plates for laser lithography and metrology systems

Cleanroom Assembly & Packaging Protocols

Components requiring high cleanliness undergo multi-stage ultrasonic degreasing and deionized water rinsing before entering our certified cleanrooms. Sub-assemblies are completed in ISO Class 6 or Class 7 environments, vacuum-sealed in cleanroom-grade antistatic polyethylene bags, and double-bagged for direct introduction into customer clean environments without additional on-site cleaning loops.

Why Semiconductor Equipment OEMs Partner with Shine

• Integrated Cleanroom Workflow - In-house ISO Class 6, 7, and 8 cleanrooms for ultrasonic DI water washing, mechanical sub-assembly, and cleanroom double-bag packaging.
• Vacuum-Grade Surface Finishes - Sealing faces machined to Ra 0.2 µm with controlled O-ring gland geometries and verified leak-tightness.
• Fab-Proven Materials - Decades of machining experience across certified 6061-T6, 316L, virgin/ceramic-filled PEEK, PEI Ultem, and PTFE.
• Lot-by-Lot Metrology Verification - Zeiss CMM reports, SmartScope vision measurement logs, and material test certificates delivered with every shipment.

Frequently Asked Questions